ISD_ORDE.PDF

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®
A Winbond Company
Ordering Information
ChipCorder and VoiceDSP Device Nomenclature
CHIPCORDER DEVICE NOMENCLATURE
ISD ____ __ __ __ __ __
ChipCorder Series:
10
11
12
14
15
25
33
4002
4003
4004
5008
MicroTAD
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ISD1000A
ISD1100
ISD1200
ISD1400
ISD1500
ISD2500
ISD33000
ISD4002
ISD4003
ISD4004
ISD5008
ISDMicroTAD
Special Temperature Field:
Blank =
D
I
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Commercial, packaged (0°C to +70°C) or
Commercial, die (0°C to +50°C)
Extended, packaged only (–20°C to +70°C)
Industrial, packaged only (–40°C to +85°C)
Package Type:
E
G
P
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28-Lead 8x13.4-mm Thin Small Outline
Package (TSOP)
28-Lead 0.350-inch Small Outline Integrated
Circuit (SOIC)
28-Lead 0.600-inch Plastic Dual Inline
Package (PDIP)
28-Lead 0.300-inch Small Outline Integrated
Circuit (SOIC)
32-lead 8x20-mm Thin Small Outline
Package (TSOP)
Wafer Form
Die
Chip Scale Package (CSP)
Duration:
06
10
12
16
20
32
40
48
60
64
75
90
120
120-4
150
180
240
04M
05M
06M
08M
10M
12M
14M
16M
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6 seconds
10 seconds
12 seconds
16 seconds
20 seconds
32 seconds
40 seconds
48 seconds
60 seconds
64 seconds
75 seconds
90 seconds
120 seconds
120 seconds (at 4 KHz sampling rate)
150 seconds
180 seconds
240 seconds
4 minutes
5 minutes
6 minutes
8 minutes
10 minutes
12 minutes
14 minutes
16 minutes
S
T
W
X
Z
ISD
1
Ordering Information
VOICEDSP DEVICE NOMENCLATURE
I S D - T 3 6 0 S C F / J _ -R
360
2
Voice Solutions in Silicon
™

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