ISDC_PHY.PDF

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A Winbond Company
Device Physical Dimensions
for ChipCorder Products
The following information lists ISD devices and their associated packaging options.
Table 1: ISD Device Package Options
Package Options
1
ISD Series
E
G
P
n
n
n
S
n
n
n
n
n
n
n
n
n
n
T
X
n
n
n
W
Z
8x13.4mm 0.350 inch 0.600 inch 0.300 inch
8x20mm
Die Wafer Chip Scale
TSOP (28 L) SOIC (28 L) PDIP (28 L) SOIC (28 L) TSOP (32 L) Form Form
(
µ
BGA)
ISD1100 Series
ISD1200 Series
ISD1400 Series
ISD2500 Series
ISD33000 Series
ISD4002 Series
ISD4003 Series
ISD4004 Series
ISD MicroTAD
ISD5008 Series
1.
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
E
G
P
S
T
Z
=
=
=
=
=
=
28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1
28-Lead 0.350-Inch Plastic Small Outline Package (SOIC)
28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP)
28-Lead 0.300-Inch Plastic Small Outline Package (SOIC)
32-Lead 8x20mm Plastic Thin Small Outline Package (TSOP) Type 1
Chip scale (
µ
BGA) package (CSP)
Following the packaging options are the bonding physical layout for the:
ISD1100 Series, ISD1200 Series, ISD1400 Series, ISD2500 Series, ISD33000 Series, ISD4002 Series, and
ISD4003 Series.
ISD
1
ChipCorder Physical Dimensions
Figure 1: 28-Lead 8x13.4 mm Plastic Thin Small Outline Package (TSOP) Type I (E)
Table 2: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions
INCHES
Min
A
B
C
D
E
F
G
H
I
J
0.037
0
°
0.020
0.004
0.520
0.461
0.311
0.002
0.007
0.009
0.0217
0.039
3
°
0.022
0.041
6
°
0.028
0.008
0.95
0
°
0.50
0.10
Nom
0.528
0.465
0.315
Max
0.535
0.469
0.319
0.006
0.011
Min
13.20
11.70
7.90
0.05
0.17
0.22
0.55
1.00
3
°
0.55
1.05
6
°
0.70
0.21
MILLIMETERS
Nom
13.40
11.80
8.00
Max
13.60
11.90
8.10
0.15
0.27
NOTE:
Lead coplanarity to be within 0.004 inches.
2
Voice Solutions in Silicon™
ChipCorder Physical Dimensions
Figure 2: 28-Lead 0.350-Inch Plastic Small Outline Integrated Circuit (SOIC) (G)
Table 3: Plastic Small Outline Integrated Circuit (SOIC) (G) Dimensions
INCHES
Min
A
B
C
D
E
F
G
H
0.463
0.020
0.706
0.086
0.340
0.004
0.014
Nom
0.714
0.088
0.346
0.007
0.016
0.050
0.470
0.031
0.477
0.04
11.76
0.51
Max
0.718
0.090
0.350
0.010
0.020
Min
17.93
2.18
8.64
0.102
0.36
MILLIMETERS
Nom
18.14
2.24
8.79
0.178
0.41
1.27
12.00
0.79
12.12
1.07
Max
18.24
2.29
8.89
0.254
0.48
NOTE:
Lead coplanarity to be within 0.004 inches.
ISD
3
ChipCorder Physical Dimensions
Figure 3: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)
Table 4: Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
Min
A
B1
B2
C1
C2
D
D1
E
F
G
H
J
S
q
0.008
0.070
0
°
0.015
0.125
0.015
0.055
0.018
0.060
0.100
0.010
0.075
0.012
0.080
15
°
0.20
1.78
0
°
0.135
0.022
0.065
0.065
0.600
0.530
0.540
1.445
Nom
1.450
0.150
0.070
0.075
0.625
0.550
0.19
0.38
3.18
0.38
1.40
0.46
1.52
2.54
0.25
1.91
0.30
2.03
15
°
3.43
0.56
1.65
1.65
15.24
13.46
13.72
Max
1.455
Min
36.70
MILLIMETERS
Nom
36.83
3.81
1.78
1.91
15.88
13.97
4.83
Max
36.96
4
Voice Solutions in Silicon™
ChipCorder Physical Dimensions
Figure 4: 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S)
Table 5: Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions
INCHES
Min
A
B
C
D
E
F
G
H
0.400
0.024
0.701
0.097
0.292
0.005
0.014
Nom
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
0.410
0.040
10.16
0.61
Max
0.711
0.104
0.299
0.0115
0.019
Min
17.81
2.46
7.42
0.127
0.35
MILLIMETER
Nom
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
10.41
1.02
Max
18.06
2.64
7.59
0.29
0.48
NOTE:
Lead coplanarity to be within 0.004 inches.
ISD
5

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