IC22_PACKAGES_1.PDF

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PACKAGE INFORMATION
Page
Index
DBS
DIP
HDIP
LQFP
PLCC
QFP
SDIP
SIL
SO
SSOP
SQFP
Soldering
1816
1818
1822
1823
1827
1830
1836
1839
1841
1849
1851
1852
Philips Semiconductors
Package information
INDEX
NAME
DBS (DIL-bent-SIL)
DBS9P
DBS13P
plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
DESCRIPTION
Package outlines
VERSION
PAGE
SOT157-2
SOT141-6
DIP (dual in-line package)
DIP8
DIP16
DIP20
DIP28
plastic dual in-line package; 8 leads (300 mil)
plastic dual in-line package; 16 leads (300 mil); long body
plastic dual in-line package; 20 leads (300 mil)
plastic dual in-line package; 28 leads (600 mil)
SOT97-1
SOT38-1
SOT146-1
SOT117-1
HDIP (heat-dissipating dual in-line package)
HDIP18
plastic heat-dissipating dual in-line package; 18 leads
plastic low profile quad flat package; 48 leads; body 7
×
7
×
1.4 mm
plastic low profile quad flat package; 64 leads; body 10
×
10
×
1.4 mm
plastic low profile quad flat package; 128 leads; body 14
×
20
×
1.4 mm
SOT398-1
LQFP (low profile quad flat package)
LQFP48
LQFP64
LQFP100
LQFP128
SOT313-2
SOT314-2
SOT425-1
plastic low profile quad flat package; 100 leads; body 14
×
14
×
1.4 mm SOT407-1
PLCC (plastic leaded chip carrier)
PLCC44
PLCC68
PLCC84
plastic leaded chip carrier; 44 leads
plastic leaded chip carrier; 68 leads
plastic leaded chip carrier; 84 leads
SOT187-2
SOT188-2
SOT189-2
QFP (quad flat package)
QFP44
QFP44
QFP64
QFP80
QFP80
QFP100
plastic quad flat package; 44 leads (lead length 2.35 mm);
body 14
×
14
×
2.2 mm
plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10
×
10
×
1.75 mm
plastic quad flat package; 64 leads (lead length 1.6 mm);
body 14
×
14
×
2.7 mm
plastic quad flat package; 80 leads (lead length 1.95 mm);
body 14
×
20
×
2.8 mm
plastic quad flat package; 80 leads (lead length 2.35 mm);
body 14
×
20
×
2.8 mm
plastic quad flat package; 100 leads (lead length 1.95 mm);
body 14
×
20
×
2.7 mm; high stand-off height
SOT205-1
SOT307-2
SOT393-1
SOT318-2
SOT318-3
SOT317-1
SDIP (shrink dual in-line package)
SDIP32
SDIP42
SDIP52
plastic shrink dual in-line package; 32 leads (400 mil)
plastic shrink dual in-line package; 42 leads (600 mil)
plastic shrink dual in-line package; 52 leads (600 mil)
SOT232-1
SOT270-1
SOT247-1
SIL (single in-line)
SIL9MPF
SIL9P
1996 Nov 05
plastic single in-line medium power package with fin; 9 leads
plastic single in-line power package; 9 leads
2
SOT110-1
SOT131-2
Philips Semiconductors
Package information
Package outlines
NAME
SO (small outline)
SO8
SO8
SO16
SO16
SO20
SO24
SO28
SO32
DESCRIPTION
VERSION
PAGE
plastic small outline package; 8 leads; body width 3.9 mm
plastic small outline package; 8 leads (straight); body width 3.9 mm
plastic small outline package; 16 leads; body width 3.9 mm
plastic small outline package; 16 leads; body width 7.5 mm
plastic small outline package; 20 leads; body width 7.5 mm
plastic small outline package; 24 leads; body width 7.5 mm
plastic small outline package; 28 leads; body width 7.5 mm
plastic small outline package; 32 leads; body width 7.5 mm
SOT96-1
SOT96-2
SOT109-1
SOT162-1
SOT163-1
SOT137-1
SOT136-1
SOT287-1
SSOP (shrink small outline package)
SSOP20
SSOP28
plastic shrink small outline package; 20 leads; body width 4.4 mm
plastic shrink small outline package; 28 leads; body width 5.3 mm
SOT266-1
SOT341-1
SQFP (shrink quad flat package)
SQFP208
plastic shrink quad flat package; 208 leads (lead length 1.95 mm);
body 28
×
28
×
3.4 mm
SOT316-1
1996 Nov 05
3
Philips Semiconductors
Package information
DBS
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
Package outlines
SOT157-2
non-concave
D
x
Dh
Eh
view
B:
mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
v
M
1
Z
e
1
e
b
p
w
M
9
m
e
2
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
17.0
15.5
A
2
4.6
4.2
b
p
0.75
0.60
c
0.48
0.38
D
(1)
24.0
23.6
d
20.0
19.6
D
h
10
E
(1)
12.2
11.8
e
5.08
e
1
e
2
E
h
6
j
3.4
3.1
L
12.4
11.0
L
3
2.4
1.6
m
4.3
Q
2.1
1.8
v
0.8
w
0.25
x
0.03
Z
(1)
2.00
1.45
2.54 5.08
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT157-2
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-03-11
97-12-16
1996 Nov 05
4
Philips Semiconductors
Package information
Package outlines
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
x
D
Dh
Eh
view
B:
mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
v
M
1
Z
e
e
1
b
p
w
M
13
m
e
2
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
17.0
15.5
A
2
4.6
4.2
b
p
0.75
0.60
c
0.48
0.38
D
(1)
24.0
23.6
d
20.0
19.6
D
h
10
E
(1)
12.2
11.8
e
3.4
e
1
1.7
e
2
5.08
E
h
6
j
3.4
3.1
L
12.4
11.0
L
3
2.4
1.6
m
4.3
Q
2.1
1.8
v
0.8
w
0.25
x
0.03
Z
(1)
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT141-6
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-03-11
97-12-16
1996 Nov 05
5

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