LH76 TX-R32LX86K.pdf

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ORDER NO. MTV0801645CE
LCD TV
TX-R32LX86K
LH76 Chassis
Specifications
Power Source :
Power Consumption
Average Use
Standby condition
Display panel
Aspect Ratio
Visible screen size
(No. of pixels)
Sound
Speaker
Audio Output
Headphones
PC signals
160 mm × 42 mm × 2 pcs, 8
Ω
20 W (10 W + 10 W), 10% THD
M3 (3.5 mm) stereo mini Jack × 1
VGA, SVGA, XGA
SXGA ...... (compressed)
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Receiving Systems / Band name
SYSTEMS
FUNCTIONS
16:9
698 mm (W) × 393 mm (H)
1,049,088 (1,366 (W) × 768 (H))
148 W
0.3 W
AC 220-240 V, 50/60 Hz
———————————————————————————————————————
1
2
3
4
5
6
7
PAL B, G, H
PAL I
PAL D, K
SECAM B, G
SECAM D, K
SECAM K1
NTSC M (NTSC 3.58 / 4.5 MHz)
———————————————————————————————————————
Reception
of broadcast
transmission and
playback from
video cassette tape
recorders.
© 2008 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TX-R32LX86K
8
9
10
11
12
13
14
NTSC 4.43 / 5.5 MHz
NTSC 4.43 / 6.0 MHz
NTSC 4.43 / 6.5 MHz
NTSC 3.58 / 5.5 MHz
NTSC 3.58 / 6.0 MHz
NTSC 3.58 / 6.5 MHz
SECAM I
Playback from
special VCR’s or DVD.
———————————————————————————————————————
15
16
17
PAL 60 Hz / 5.5 MHz
PAL 60 Hz / 6.0 MHz
PAL 60 Hz / 6.5 MHz
Playback from
Special Disc Players
and Special VCR’s or DVD.
Aerial - Rear
Operation Conditions
VHF / UHF
Temperature : 0°C - 35°C
Humidity : 20% -- 80% RH (non-condensing)
Connection Terminals :
AV1
Input
AUDIO L-R
VIDEO
COMPONENT
RCA PIN Type × 2
RCA PIN Type × 1
Y
P
B
/ C
B
, P
R
/ C
R
AV2
Input
AUDIO L-R
VIDEO
COMPONENT
RCA PIN Type × 2
RCA PIN Type × 1
Y
P
B
/ C
B
, P
R
/ C
R
AV3
Input
AUDIO L-R
VIDEO
S VIDEO
AV4
Input
AUDIO L-R
VIDEO
S VIDEO
Others
HDMI 1/2 Input
PC Input
RCA PIN Type × 2
RCA PIN Type × 1
Mini DIN 4-pin
RCA PIN Type × 2
RCA PIN Type × 1
Mini DIN 4-pin
TYPE A Connectors
HIGH-DENSITY D-SUB 15 PIN
0.5 V[rms]
1.0 V[p-p] (75
Ω
)
1.0 V[p-p] (including synchronization)
±0.35 V[p-p]
0.5 V[rms]
1.0 V[p-p] (75
Ω
)
1.0 V[p-p] (including synchronization)
±0.35 V[p-p]
0.5 V[rms]
1.0 V[p-p] (75
Ω
)
Y: 1.0 V[p-p] (75
Ω)
C: 0.286 V[p-p] (75
Ω)
0.5 V[rms]
1.0 V[p-p] (75
Ω
)
Y: 1.0 V[p-p] (75
Ω)
C: 0.286 V[p-p] (75
Ω)
!
This TV supports “HDAVI Control 3”
function.
R, G, B / 0.7 V[p-p] (75
Ω)
HD, VD / TTL LEVEL 2.0-5.0 V[rms] (high
impedance)
Card Slot
Monitor
Output
AUDIO L-R
VIDEO
SD CARD slot × 1
RCA PIN Type × 2
RCA PIN Type × 1
0.5 V[rms] (high impedance)
1.0 V[p-p] (75Ω )
Dimensions (W × H × D)
821 mm × 580 mm × 225 mm (With TV Stand)
821 mm × 539 mm × 98 mm (TV only)
Mass
18.0 kg Net (With TV Stand)
15.5 kg Net (TV only)
Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
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TX-R32LX86K
CONTENTS
Page
1 Safety Precautions
1.1. General Guidelines
1.2. Touch-Current Check
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
3 About Lead Free Solder (PbF)
4 Self Check Function
4.1. Self Check
4.2. Power LED Blinking Timing Chart
5 Chassis Board
5.1. Chassis Installation
6 Location of Lead Wiring
6.1. Wire Dressing
6.2. Wire Dressing and Connections
7 Disassembly for Service
7.1. AC Code dressing for 2-Pin
7.2. AC Code dressing for 3-Pin
7.3. Chassis Rail Installation
7.4. VESA Bracket Installation
7.5. Pedestal Assembly Preparation
7.6. LED Panel Installation
7.7. LCD Panel Assembly Installation
5
6
7
7
7
9
9
10
10
12
13
13
13
14
15
16
19
20
4
4
4
7.8. EMI Installation
7.9. Control Panel Installation
7.10. Back Cover Installation
8 Adjustment
8.1. Voltage Chart of A Board
8.2. Voltage Chart of P board
8.3. DVCO Adjustment
9 Conductor Views
9.1. A-Board
9.2. A-Board
10 Schematic Diagram
10.1. Schematic Diagram Notes
10.2. A Board
10.3. K Board
10.4. P Board
10.5. S Board
10.6. V Board
11 Parts Location & Mechanical Replacement Parts List
11.1. Parts Location
12 Packing Exploded View
13 Replacement Parts List
13.1. Electrical Replacement Parts List
Page
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25
25
25
25
26
26
27
28
28
29
80
81
88
89
93
93
94
95
96
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TX-R32LX86K
1 Safety Precautions
1.1.
General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2.
Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe as shown in Figure 1.
3. Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part and measure the voltage at each point.
5. The potential at any point (touch current) expressed as voltage U
1
and U
2
, do not exceed the following values:
For AC: U
1
= 35 V (peak) and U
2
= 0.35 V (peak);
For DC: U
1
= 1.0 V,
NOTE :
The limit value of U
2
= 0.35 V (peak) for AC and U
1
= 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA DC.
The limit value U
1
= 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.
6. Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
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TX-R32LX86K
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-
effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the
incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motions such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
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