TY-TP65P10S.pdf

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ORDER NO. ITD0803011CE
Touch Panel
Model No.
TY-TP65P10S
TABLE OF CONTENTS
1
PAGE
Warning
--------------------------------------------------------------
2
1.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices---------- 2
1.2. About lead free solder (PbF)---------------------------- 3
Specifications
-----------------------------------------------------
4
General/Introduction
--------------------------------------------
5
3.1. PCB Stracture ---------------------------------------------- 5
Operating Instructions------------------------------------------ 6
Disassembly and Assembly Instructions
---------------40
5.1. Remove the Frame U Assy ----------------------------40
5.2. Remove the Cover-U Assy-----------------------------40
5.3. Remove the Flat bracing metal -----------------------40
5.4. Remove the Main board unit---------------------------40
5.5. Remove the Sensor-L board unit ---------------------40
5.6. Remove the Sensor-R board unit --------------------40
5.7. Remove the Right angle-UL ---------------------------41
5.8. Remove the Right angle-UR---------------------------41
Measurements and Adjustments---------------------------42
PAGE
6.1. Before the adjustment when Circuit board are
exchanged ------------------------------------------------- 42
6.2. Cautions for replacing the Circuit board------------ 42
6.3. Flow chart for replacing the Boards ----------------- 43
6.4. How to rewrite data when replacing the Main
Board-------------------------------------------------------- 44
6.5. Adjust the optical axis----------------------------------- 44
6.6. Adjust PEAKPOSI (Corner) --------------------------- 46
6.7. Setting range (first, last) of the optical axis -------- 47
6.8. Adjust and confirm the light level--------------------- 48
25-point calibration--------------------------------------------- 49
7.1. Prepare setting for adjusting PC --------------------- 49
7.2. Explanation of 25-point Calibration ------------------ 49
Dimensions
-------------------------------------------------------
52
Block Diagram
---------------------------------------------------
53
Schematic Diagram
--------------------------------------------
54
10.1. Main Board Unit Schematic Diagram --------------- 54
10.2. Sensor Board Unit Schematic Diagram ------------ 55
© 2008 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
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1 Warning
1.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)"
can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
2
1.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
PbF
stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70
°F
(30~40
°C)
higher. Please
use a high temperature soldering iron and set it to 700 ± 20
°F
(370 ± 10
°C).
• Pb free solder will tend to splash when heated too high (about 1100
°F
or 600
°C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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2 Specifications
Type
Power source
Voltage
Electric current
Supply system
Touch panel
Detection system
Panel window
Detection range
Effective detection range
Resolution
Output system
Optic element pitch
Minimum detection size
Response rate
Interface
Touch Panel
+5V DC ± 10%
Max. 450 mA
From USB bus
Infrared retroreflective detection
57
3
/
36
” (1,449 mm) (W)
×
32
1
/
4
” (819 mm) (H)
56
15
/
32
” (1,434 mm) (W)
×
31
25
/
32
” (807 mm) (H)
Same as above
Approx. 32,000
×
18,000 points *1
Coordinate output
Infrared LED x 4, CMOS image sensor
×
2
25
/
64
” (10 mm)
100 points / sec
USB 2.0 full speed device
Signals: +DATA, -DATA, VCC, GND
Connector: Type B
When operating: 32
°F
- 104
°F
(0 ~ 40°C) *2
When operating: 20 ~ 80% (No dewing) *2
Lateral light 2,000 lx + 20% (20° angle of incidence)
Frontal light 10,000 lx + 20% (90° angle of incidence)
61
3
/
64
” (1,550.8 mm) (W)
×
39
11
/
16
” (1,008.2 mm) (H)
×
1
57
/
64
” (47.9 mm) (D)
Approx. 14.8 lb (6.7 kg)
Aluminum
Temperature
Humidity
Resistance to external
light
External dimensions
Mass
Escutcheon material
*1 Resolution obtained by using a dedicated Driver software
*2 When the panel is attached to a Plasma display produced by Matsushita Electric Industrial Co., Ltd.
4
3 General/Introduction
3.1.
PCB Stracture
Unit Name
Main
Sensor-L
Sensor-R
Board Number
TXN/11WETB
TXN/22WETB
TXN/31WETB
Function
Main control
IR sensor L
IR sensor R
Contained data
Accompanying tasks
Adjusted data Copying data, adjusting gain
(If copying is not available, all adjustment is necessary)
-
Adjusting the optical axis. ranee and gain
-
Adjusting the optical axis, ranee and gain
R-sensor Board and L-sensor Board emit and receive the infrared rays.
Each Board has the infrared LED and image sensor.
Control Board contains data including infrared rays signal. image sensor-receiving position, image sensor sensitivity and its range,
etc in eeprom.
Light receiving-data of left and right sensors is analyzed by this Board and the position is determined.
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