092. Solder Joint Technology - Materials, Properties, and Reliability (2007).pdf

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King-Ning Tu
Solder Joint Technology
Materials, Properties, and Reliability
King-Ning Tu
Department of Materials Science and Engineering
University of California at Los Angeles, CA,
USA
6532
Boelter Hall
Los Angeles
90095–6595
Email, personal: kntu@ucla.edu
Library of Congress Control Number:
2007921097
ISBN-10:
0-387-38890-7
ISBN-13:
978-0-387-38890-8
Printed on acid-free paper.
C
2007
Springer Science+Business Media, LLC
All rights reserved. This work may not be translated or copied in whole or in part without the written
permission of the publisher (Springer Science+Business Media, LLC,
233
Spring Street, New York, NY
10013,
USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with
any form of information storage and retrieval, electronic adaptation, computer software, or by similar or
dissimilar methodology now known or hereafter developed is forbidden.
The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are
not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject
to proprietary rights.
e-ISBN-10:
0-387-38892-3
e-ISBN-13:
978-0-387-38892-2
9 8 7 6 5 4 3 2 1
springer.com
Contents
1 Introduction
1.1 Introduction of Solder Joint.................................................
1.2 Lead-Free Solders...............................................................
1.2.1
Eutectic Pb-Free Solders..........................................
1.2.2
High-Temperature Pb-Free Solders ............................
1.3 Solder Joint Technology ......................................................
1.3.1
Surface Mount Technology .......................................
1.3.2
Pin-through-Hole Technology....................................
1.3.3
C-4 Flip Chip Technology .......................................
1.4 Reliability Problems in Solder Joint Technology......................
1.4.1
Sn Whiskers...........................................................
1.4.2
Spalling of Interfacial Intermetallic Compounds in
Direct Chip Attachment .........................................
1.4.3
Thermal-Mechanical Stresses ....................................
1.4.4
Impact Fracture......................................................
1.4.5
Electromigration and Thermomigration......................
1.4.6
Reliability Science on the Basis of Nonequilibrium
Thermodynamics ....................................................
1.5 Future Trends in Electronic Packaging ..................................
1.5.1
The Trend of Miniaturization ...................................
1.5.2
The Trend of Packaging Integration Evolution—SIP,
SOP, and SOC .......................................................
1.5.3
Chip–Packaging Interaction......................................
1.5.4
Solderless Joints .....................................................
References.................................................................................
1
1
4
4
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12
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28
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31
31
Part I Copper–Tin Reactions
2 Copper–Tin Reactions in Bulk Samples
2.1 Introduction......................................................................
2.2 Wetting Reaction of Eutectic SnPb on Cu Foils......................
37
37
38
vi
Contents
Crystallographic Relationship between Cu
6
Sn
5
Scallop and Cu.......................................................
2.2.2
Rate of Consumption of Cu in Soldering Reaction
with Eutectic SnPb.................................................
2.3 Wetting Reaction of SnPb on Cu Foil as a Function of
Solder Composition ............................................................
2.4 Wetting Reaction of Pure Sn on Cu Foils...............................
2.5 Ternary Phase Diagram of Sn-Pb-Cu ....................................
2.5.1
Ternary SnPbCu Phase Diagrams at 200 and 170
◦
C ....
2.5.2
5Sn95Pb/Cu Reaction and Ternary SnPbCu
Phase Diagrams at 350
◦
C ........................................
2.6 Solid-State Reaction of Eutectic SnPb on Cu Foils..................
2.6.1
Formation of Cu
3
Sn and Kirkendall Voids ..................
2.7 Comparison between Wetting and Solid-State Reactions ..........
2.7.1
Morphology of Wetting Reaction and
Solid-State Aging....................................................
2.7.2
Kinetics of Wetting Reaction and
Solid-State Aging....................................................
2.7.3
Reactions Controlled by Rate of Gibbs Free
Energy Change.......................................................
2.8 Wetting Reaction of Pb-Free Eutectic Solders on Thick
Cu UBM...........................................................................
References.................................................................................
3 Copper–Tin Reactions in Thin-Film Samples
3.1 Introduction......................................................................
3.2 Room-Temperature Reaction in a Bilayer Thin Film
of Sn/Cu .........................................................................
3.2.1
Phase Identification by Glancing Incidence
X-ray Diffraction ....................................................
3.2.2
Growth Kinetics of Cu
6
Sn
5
and Cu
3
Sn.......................
3.2.3
Copper Is the Dominant Diffusing Species ..................
3.2.4
Kinetic Analysis of Sequential Formation of Cu
6
Sn
5
and Cu
3
Sn.............................................................
3.2.5
Atomistic Model of Interfacial-Reaction Coefficient ......
3.2.6
Measurement of Strain in Cu and Sn Thin Films.........
3.3 Spalling in Wetting Reaction of Eutectic SnPb on Cu
Thin Films........................................................................
3.4 No Spalling in High-Pb Solder on Au/Cu/Cu-Cr
Thin Films........................................................................
3.5 Spalling in Eutectic SnPb Solder on Au/Cu/Cu-Cr
Thin Films........................................................................
3.6 No Spalling in Eutectic SnPb on Cu/Ni(V)/Al
Thin Films........................................................................
2.2.1
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